[포토] 국내 연구진, 글래스 기반 웨이퍼 레벨 패키징 기술 개발에 속도

Korean researchers have developed glass-based wafer-level packaging technology that enables superior hermetic sealing for RF filters, overcoming performance limitations in next-generation 6G communication systems. This domestically developed technology is critical for achieving the miniaturization and performance requirements essential for 6G infrastructure. The breakthrough positions Korea as a key innovator in advanced semiconductor packaging for future wireless communications.