[소부장 온에어]한미, 하이브리드 본더 2세대 연내 공개

Hanmi Semiconductor is proactively securing its lead in the next-generation HBM market by unveiling a 2nd generation Hybrid Bonder and investing in massive dedicated production facilities. This strategic 'two-track' approach, which balances current TC Bonder dominance with future-ready Hybrid Bonding technology, is essential for overcoming technical barriers in ultra-high stacking beyond 20 layers.