[소부장 레이더] 한화세미텍, 1분기 보릿고개…HBM4 효과 언제쯤

Hanwha Semitech's Q1 performance dip highlights the high sensitivity of equipment manufacturers to the investment vacuum occurring during the HBM generational shift. The company's strategic expansion into FO-PLP and Hybrid Bonding technology is a critical move to diversify its portfolio and secure leadership in the next-generation AI chip packaging market.