[반도체 온에어]SK하이닉스, HBM 발열 잡는다…차세대 냉각기술 공개

SK Hynix's introduction of iHBM with internal cooling elements marks a critical shift in AI memory design, addressing the thermal bottlenecks that limit high-performance computing. By integrating ICE directly into the package, the industry can overcome the physical barriers of HBM stacking and high-speed data transmission, ensuring stability for next-generation AI accelerators. This innovation solidifies SK Hynix's leadership in the HBM market while providing customers with a seamless transition to more efficient AI data center architectures.